Hard-to-cut machining

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  Grinding Center GCV-40

  『Grinding Center』specializing in micro milling of brittle material parts like electrostatic chuck used in semiconductor manufacturing

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  Grinding Center GCV-30

  『Grinding Center』specializing in micro milling of brittle material parts like electrostatic chuck used in semiconductor manufacturing

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  Ultrasonic machine

  Ultrasonic spindle for small hole and groove machining of brittle materials

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